Abstract:

　　Following the successful introduction of EcoPaXX, a bio-based, high performance engineering plastic, DSM Engineering Plastics will be launching Arnitel Eco+ at K 2010. The world' largest plastics and rubber trade fair to be held this year in Düsseldorf, Germany, from October 27 to November 3.

　　Arnitel Eco+ is a high performance thermoplastic copolyester (TPC) with a 20%-50% content derived from renewable resources, depending on the hardness of the grade. The new material, which is already being sampled to selected customers, is specifically suited for applications in Consumer Electronics, Sports & Leisure and Automotive Interior.

　　Francis Aussems, Project Manager Bio-Polyesters for DSM Engineering Plastics, says: "There is a clear customer need for bio-based engineering plastics which combine performance with a reduced carbon footprint. LCA calculations of Arnitel Eco+ show a reduction in greenhouse gas emissions, cradle to gate, of up to 50% versus oil based thermoplastic copolyesters. Using our long-standing experience in Arnitel product development and our flexible manufacturing base, we are pleased that we are able to introduce this new extension to the Arnitel family."

　　Arnitel Eco+ is a first generation product, which is currently not yet suitable for high temperatures. However, future generations of the product are envisaged for the future.

　　This innovation follows the successful launches of Arnitel XG for halogen-free flame retardant solution for wire & cables and Arnitel C, a breakthrough technology for wire and cable coating, delivering the best high-heat aging performance of any TPC. This underlines DSM's commitment to the introduction of new products with lower environmental impact.